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| HS-1410RH Data Sheet August 1999 File Number 4470.1 Radiation Hardened, High Speed, Low Power, Current Feedback Op Amp with Output Disable The Radiation Hardened HS-1410RH is a high speed, low power current feedback amplifier built with Intersil's proprietary complementary bipolar UHF-1 (DI, bonded wafer) process. This technology provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices are QML approved and are manufactured and screened in full compliance with MIL-PRF-38535. This amplifier features a TTL/CMOS compatible DISABLE control, pin 10, which when pulled low, reduces the supply current and forces the output into a high impedance state. This allows easy implementation of simple, low power multiplexing circuits in redundant spacecraft designs. The wide bandwidth and fast slew rate make these devices ideal for pulse and video amplifier and routing applications. The high output current and disable feature provide the perfect combination needed for A/D driver/multiplexer circuits. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-98518. A "hot-link" is provided on our homepage for downloading. http://www.intersil.com/spacedefense/space.htm Features * Electrically Screened to SMD # 5962-98518 * QML Qualified per MIL-PRF-38535 Requirements * Radiation Environment - Total Dose. . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEL . . . . . . . . . . . . . . None (Bonded Wafer DI Process) * Wide 3dB Bandwidth (Typ) . . . . . . . . . . . . . . . . . . 360MHz * High Slew Rate (Typ) . . . . . . . . . . . . . . . . . . . . 1000V/S * High Output Current (Typ) . . . . . . . . . . . . . . . . . . . . 60mA * Low Supply Current (Typ) . . . . . . . . . . . . . . . . . . . . 5.9mA * Output Enable/Disable Time (Typ) . . . . . . . . . 180ns/35ns * Upgrade for CLC410/411 Applications * Multiplexing Flash A/D Drivers * High Speed Signal Switching and Routing * Pulse and Video Amplifiers * Wideband Amplifiers * Imaging Systems Pinout HS9-1410RH (FLATPACK) CDFP3-F10 TOP VIEW Ordering Information ORDERING NUMBER 5962F9851801VXC INTERNAL MKT. NUMBER HS9-1410RH-Q TEMP. RANGE (oC) -55 to 125 NC -IN +IN VNC 1 2 3 4 5 10 9 8 7 6 DISABLE V+ OUT NC NC 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999 HS-1410RH Die Characteristics DIE DIMENSIONS: 59 mils x 59 mils x 19 mils 1 mil (1500m x 1500m x 483m 25.4m) INTERFACE MATERIALS: Glassivation: Type: Nitride Thickness: 4kA 0.5kA Top Metallization: Type: Metal 1: AICu(2%)/TiW Thickness: Metal 1: 8kA 0.4kA Type: Metal 2: AICu(2%) Thickness: Metal 2: 16kA 0.8kA Substrate: UHF-1, Bonded Wafer, DI ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): Floating (Recommend Connection to V-) ADDITIONAL INFORMATION: Transistor Count: 75 Metallization Mask Layout HS-1410RH -IN DISABLE V+ OUT +IN V- OPTIONAL GND (NOTE) NOTE: This pad is not bonded out on packaged units. Die users may set a GND reference, via this pad, to ensure the TTL compatibility of the DIS input when using asymmetrical supplies (e.g. V+ = 10V, V- = 0V). All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 2 |
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